IEC 60191-5:1997 pdf download.Mechanical standardization of semiconductor devices – Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
1 Scope
This part of IEC 601 91 on mechanical standardization gives recommendations applying to
integrated circuits supplied in packages using tape automated bonding (TAB) as the principal
component for structural and interconnection functions. This standard is applicable to the
finished component supplied by a manufacturer to a user and does not define requirements
relating to the IC to tape interface (the inner lead bond or ILB).
2 Terms and definitions
For the purpose of this part of IEC 601 91 , the following definitions apply.
2.1 chip (or die): A portion of a silicon wafer which contains at least one integrated circuit
which has been separated from the wafer containing an array of such devices.
2.2 tape carrier 1) : A linear strip of a laminate of an insulating material and a conducting
material patterned so as to mechanically support and electrically contact a chip. The strip may
contain a series of such patterns and each such pattern is a tape site.
2.3 sprocket hole: A row of holes on each side of the tape carrier used for driving the tape
through equipment or for coarse alignment.
2.4 lead pattern: The pattern of etched conductive material on a tape carrier including the
inner and outer leads and the test pads.
2.5 inner lead: The extreme interior end of the lead pattern conductor which is used for
connection to a chip.
2.6device window: A perforation at the centre of a tape site within which the chip and the
inner leads are located.
2.7 outer lead or excise window: A rectangular perforation on each side of the tape site
over which the conductor pattern is suspended. These perforations may form a continuous
opening around the tape site. The bonded circuit is normally excised from the tape by cutting in
this opening.
2.8 support ring: The portion of the insulating film which supports the conductor pattern
between the device window and the outer lead window.
2.9 body size: The outside dimension of the support ring.
2.1 0 outer lead: The extreme exterior end of the lead pattern conductor which is used for
connection at the next level of assembly after the bonded IC is excised from the tape carrier.
2.1 1 alignment holes: Auxiliary holes in the polymer film used for fine alignment of the tape
carrier during inner lead bonding, electrical test and burn-in, excise and outer lead bonding.
2.1 2 test pads: Portions of the conductor pattern which are used to make electrical contact to
the tape carrier during electrical test and burn-in operations.
3 Description of tape automated bonding (TAB)
Tape automated bonding (TAB) is an assembly process applicable to integrated circuits (IC)
which are used without conventional packages, that is with the silicon chip exposed. The basic
principle is the attachment of each silicon chip to a special flexible tape. Like a flexible printed
circuit, the tape consists of a thin plastic base on which metal conductors have been formed. At
the inner end of the conductors the pattern matches the pattern of connecting pads on the chip.
At the extreme outer end of the conductors, each conductor is attached to a pad for temporary
contact for electrical test. Between the test pad locations and the chip connection points, there
is a length of conductor unsupported by the insulating film which will ultimately form the outer
lead of the TAB package. Like a movie film, the tape has a row of sprocket holes on each side
of the tape width which are used to move the tape easily during processing.
IEC 60191-5:1997 pdf download
